• curing kinetic model of the 2-ethyl-4-methylimidazole/epoxy system

    Curing kinetic model of the 2-ethyl-4-methylimidazole/epoxy system

    The system of bisphenol-A diglycidyl ether type epoxy resin (DGEBA) cured with 2-ethyl-4-methylimidazole (2,4-EMI) was studied by means of differential scanning calorimetry (DSC) in isothermal mode.

  • us5508328a - curing epoxy resins using dicy, imidazole and acid

    US5508328A - Curing epoxy resins using dicy, imidazole and acid

    A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent.

  • a comparison of some imidazoles in the curing of epoxy resin

    A comparison of some imidazoles in the curing of epoxy resin

    A comparison of some imidazoles in the curing of epoxy resin ... adhesives were prepared by the melt blending method with bisphenol A epoxy resin (E-20), hexamethylenetetramine (HMTA) as a curing

  • imidazole derivatives as latent curing agents for epoxy thermosetting

    Imidazole Derivatives as latent curing Agents for epoxy thermosetting

    Imidazole Derivatives as latent curing Agents for epoxy thermosetting Resins. ... the melt blending method with bisphenol A epoxy resin (E-20), hexamethylenetetramine (HMTA) as a curing agent and

  • study on curing kinetics of a diglycidyl ether of bisphenol a epoxy

    Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy

    A modified imidazole curing agent, EMI-g-BGE, was encapsulated for one-package of diglycidyl ether of bisphenol A (DGEBA) epoxy resin system. Polyetherimide (PEI) was used as the wall material

  • preparation of 2-ethyl-4-methylimidazole derivatives as latent curing

    Preparation of 2-ethyl-4-methylimidazole derivatives as latent curing

    Preparation of 2-ethyl-4-methylimidazole derivatives as latent curing agents and their application in curing epoxy resin ... state of 2-ethyl-4-methyl imidazole-cured epoxy network have been

  • curing agent - an overview | sciencedirect topics

    Curing Agent - an overview | ScienceDirect Topics

    A combination of amine with acid such as ethylenediamine/phthalic acid, 1,3-propanediamine/phthalic acid, ethylene-diamine/adipic acid, 1,3-propane diamine/adipic acid and p-phenylene diamine/adipic acid are also employed as curing agents for vegetable oil-based epoxy resins. 18 Epoxy resin can also be cured by polyimide, polyamic acid and

  • acceleration of epoxy resin systems

    Acceleration of Epoxy Resin Systems

    hydrolyzed DGEBA resins became the “standard bisphenol A epoxy” or “liquid epoxy resin (L.E.R.)” type resin, as it met the requirements of the broadest assortment of end-users. Although these higher viscosity hydrolyzed resins are needed for some applications, other applications, such as the molding of large composites, greatly

  • issued december 20, 1990 32

    Issued December 20, 1990 32

    and the all are important curing agents for epoxy resin. Aliphatic amine (Three Bond 2103) is curing agent for epoxy resin ant able to cure at room temperature. The cured resin has excellent properties, and its heat resistance is 100°C. Aromatic amine has been developed to achieve greater heat resistance and chemical resistance than

  • ca1175996a - co-curing agents for epoxy resins - google patents

    CA1175996A - Co-curing agents for epoxy resins - Google Patents

    ABSTRACT OF THE DISCLOSURE A N-substituted piperazine or N-substituted homopiperazine adduct with a polyepoxide is used as a co-curing agent such as dicyandiamide. a carboxylic acid anhydride, or a dihydrazide. The preferred adducts have a ratio of epoxy groups to secondary amino groups of between 1.2:1 and 3:1.

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